Patent attributes
Embodiments relate to a semiconductor device and a method for manufacturing the same. Embodiments may include forming a lower porous oxide layer on a semiconductor substrate having a conductive layer, forming a pyrolytic polymer layer on the lower porous oxide layer, forming an upper porous oxide layer on the pyrolytic polymer layer, forming a via hole by sequentially etching the upper porous oxide layer, the pyrolytic polymer layer, and the lower porous oxide layer, forming a trench having a width larger than a width of the via hole by sequentially etching the upper porous oxide layer and the pyrolytic polymer layer in such a manner that the trench is connected with the via hole, forming metal interconnections by filling the via hole and the trench with a metal thin film, and forming a vacuum between the upper and lower porous oxide layers by removing the pyrolytic polymer layer.
