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US Patent 7575476 Power distribution module and header assembly therefor

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
75754761
Patent Inventor Names
Yezdi N. Soonavala1
Adam P. Tyler1
Douglas Scott Simpson1
Date of Patent
August 18, 2009
1
Patent Application Number
118884691
Date Filed
August 1, 2007
1
Patent Primary Examiner
‌
Truc T. Nguyen
1
Patent abstract

A power distribution module includes a housing having a component chamber configured to house an electrical component therein. The housing includes at least a portion thereof defining a shield interface. A header assembly is coupled to the housing. The header assembly includes a header body including an inner body portion and an outer body portion, and the header assembly further includes a header shield positioned between the inner and outer body portions. The header shield engages the shield interface of the housing when the header assembly is coupled to the housing.

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