Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsiu-Yuan Hsu0
Nakao Kenzo0
Date of Patent
August 18, 2009
0Patent Application Number
121515660
Date Filed
May 7, 2008
0Patent Primary Examiner
Patent abstract
An IC socket for receiving an IC package includes a socket body with a plurality of contacts disposed therein, a lid mounted on the socket body and movable relative to the socket body in an up-down direction, and a pressing mechanism driven by the lid. The pressing mechanism has a pusher able to apply a substantial balanced force to the IC package, and thus any distortion of the IC package will be prevented effectively.
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