Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Xio Hu Liu0
James P Doyle0
Michael W Lane0
Thomas M Shaw0
Eric G Liniger0
Griselda Bonilla0
Howard S Landis0
Date of Patent
August 11, 2009
0Patent Application Number
123577210
Date Filed
January 22, 2009
0Patent Primary Examiner
Patent abstract
The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure sandwiched between said plates.
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