US Patent 7572314 Carbon containing nickel particle and conductive paste

Patent 7572314 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on August, 2009 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

75723140

Patent Inventor Names

Tae-Kyoung Kim0

Jae-young Choi0

Seon-mi Yoon0

Soon-ho Kim0

Hak-joon Lee0

Date of Patent

August 11, 2009

Patent Application Number

118226390

Date Filed

July 9, 2007

Patent Primary Examiner

Roy King

Patent abstract

Carbon-containing nickel-particle powder is provided. The carbon-containing nickel-particle powder has improved shrinkage property when fired due to the presence of carbon. Also, the carbon-containing nickel-particle powder has a very restricted degree of forming agglomerates.