Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 4, 2009
Patent Application Number
11341101
Date Filed
January 27, 2006
Patent Primary Examiner
Patent abstract
A silicon wafer substrate is used in ink-jet printhead fabrication. The fabrication process is improved by simultaneously forming MOSFET source/drain contact vias simultaneously with substrate contact vias. A dry etch having a silicon oxide:silicon etch rate of at least 10:1 is employed.
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