Patent attributes
A stack mold carrier (200) for use in a stack mold system (500) is provided. The stack mold system includes a pair of rails (600), the stack mold carrier, a mold (not labeled) and a cooling assembly (40). The stack mold carrier includes a carrier portion (20) and a pair of bridge portions (22) extending from opposite ends of the carrier portion. The stack mold carrier strides over the rails with each of the bridge portions slidably mounted on a corresponding one of the rails. The mold includes a middle mold plate (504), a stationary portion (506) and a movable portion (502). The middle mold plate is supported on the carrier portion and is movable with the stack mold carrier relative to the stationary portion and the movable portion along the rails. The cooling assembly is configured for the mold installed on the carrier portion.
