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US Patent 7566833 Wired circuit board and production method thereof

Patent 7566833 was granted and assigned to Nitto Denko on July, 2009 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
Nitto Denko
Nitto Denko
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
75668331
Patent Inventor Names
Jun Ishii1
Yasunari Ooyabu1
Yasuhito Funada1
Date of Patent
July 28, 2009
1
Patent Application Number
114393071
Date Filed
May 24, 2006
1
Patent Primary Examiner
‌
Ishwar (I. B.) Patel
1
Patent abstract

A wired circuit board that can remove static electricity not only from an insulating base layer and an insulating cover layer but also from a terminal portion, to effectively prevent an electronic component mounted from being damaged by static electricity and also prevent stripping of a semi-conductive layer. In a suspension board with circuit including an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, and an insulating cover layer, formed on the insulating cover layer, to cover the conductive pattern and form an opening, semi-conductive layer is formed in succession on an upper surface of the insulating base layer covered with the insulating cover layer, on a lateral side surface and an upper surface of the conductive pattern, and on a lateral side surface of the insulating base layer adjacent to the metal supporting board.

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