US Patent 7564119 Adhesive sheet for laser dicing and its manufacturing method

Patent 7564119 was granted and assigned to Nitto Denko on July, 2009 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

75641190

Patent Inventor Names

Yuji Okawa0

Date of Patent

July 21, 2009

Patent Application Number

110547950

Date Filed

February 10, 2005

Patent Primary Examiner

W. David Coleman

Patent abstract

An adhesive sheet for laser dicing is used for dicing a workpiece into individual chips by light absorption ablation of laser beam and has at least an adhesive layer on one side of a base material which has a surface opposite to the adhesive layer having no convex parts of width (W) of 20 mm or less and height (h) of 1 μm or more, or no concave parts of width (W) of 20 mm or less and depth (d) of 1 μm or more.