US Patent 7563694 Scribe based bond pads for integrated circuits

Patent 7563694 was granted and assigned to Atmel Corporation on July, 2009 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

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Atmel Corporation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7563694

Date of Patent

July 21, 2009

Patent Application Number

11607564

Date Filed

December 1, 2006

Patent Primary Examiner

W. David Coleman

Patent abstract

A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and system comprises forming bond out pads in the scribe areas such that the bond out pads are disposed on the semiconductor wafer between the plurality of semiconductor die. Additionally, the method and system comprises separating the semiconductor wafer into individual die such that when the semiconductor wafer is separated in a first manner at least one product die is provided. Furthermore, when the semiconductor wafer is separated in a second manner at least one test die is provided.