Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasunari Ooyabu0
Hiroyuki Kurai0
Jun Ishii0
Date of Patent
July 7, 2009
Patent Application Number
11976234
Date Filed
October 23, 2007
Patent Primary Examiner
Patent abstract
A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.
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