Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 23, 2009
Patent Application Number
11427689
Date Filed
June 29, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.
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