Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 9, 2009
Patent Application Number
11456544
Date Filed
July 10, 2006
Patent Primary Examiner
Patent abstract
An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.
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