Patent attributes
A microstrip antenna configuration employs a metallic patch which is positioned on the top surface of a dielectric substrate. The dielectric substrate has the bottom surface coated with a suitable metal to form a ground plane. A hole is formed through the ground plane, through the dielectric to allow access to the bottom surface of the patch. A center conductor of a coaxial cable is directly connected to the patch. The center conductor of the coaxial cable is surrounded by a metallic housing within the substrate area. The patch forms a first plate for the capacitance while the diameter of the outer housing of the coaxial cable within the substrate is increased to form another plate on the end of the coaxial cable. The value of capacitance can be adjusted by the area of the metallic housing the relative dielectric constant of the spacing material, and the spacing between the plates. The sum of the probe inductive impedance and microstrip patch antenna input impedance using the direct probe connection is adjusted and centered at a desired design center frequency and many such frequencies can be accommodated.
