US Patent 7541826 Compliant pad wafer chuck
All edits
Edits on 17 Sep, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
Chris L. Koliopoulos0
Matthew R. Boston0
Edits on 15 Sep, 2023
Golden AI
Edits made to:
Article (+367 characters)
Article
Patent abstract
A platform is designed to support thin flat substrates, such as semiconductor wafers, during observation of characteristics of the substrates. The platform includes a rigid base having a top surface. A resilient pad is supported on the base and the pad has a top surface, at least a portion of which yieldingly supports a flat substrate placed thereon.
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07541826 Compliant pad wafer chuck US Patent 7541826 Compliant pad wafer chuck
Infobox
Patent Number
075418260
Patent Number
75418260
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
075418260
Date of Patent
June 2, 2009
0Patent Application Number
111295370
Date Filed
May 13, 2005
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 2 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07541826 Compliant pad wafer chuck
Infobox
Is a
Patent jurisdiction
Patent number
07541826
Date of patent
June 2, 2009
Patent application number
11129537
Date Filed
May 13, 2005
Patent primary examiner
Find more entities like US Patent 7541826 Compliant pad wafer chuck
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.