Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 26, 2009
Patent Application Number
10572422
Date Filed
September 18, 2004
Patent Primary Examiner
Patent abstract
A fuse structure (100) suitable for incorporation in an integrated circuit presents a reduced thermal conduction footprint to the substrate (103). A patterned material stack (102) is formed on a substrate (103) and at least a portion of a material disposed between the substrate (103) and an upper portion of the fuse structure (100) is selectively etched so as to reduce the thermal conduction pathway between the upper portion and the substrate (103). In a further aspect of the present invention, the reduced cross-section of the fuse structure (100) has an increased current density resulting in a lower amount of current being needed to program the fuse.
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