Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
You Yang Ong0
Heap Hoe Kuan0
Ma. Shirley Asoy0
Seng Guan Chow0
Dioscoro A. Merilo0
Date of Patent
May 19, 2009
0Patent Application Number
114623200
Date Filed
August 3, 2006
0Patent Primary Examiner
Patent abstract
An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and singulating the leadframe interposer from the leadframe.
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