US Patent 7534642 Methods of manufacturing an image device

In methods of manufacturing an image device, a first structure including a transparent lower portion and an opaque upper portion is formed on a substrate having a photodiode. An etch stop layer pattern positioned over the photodiode is formed on the first structure. A second structure having at least one opaque capping layer is formed on the first structure to cover the etch stop layer pattern. An opening partially exposing the lower portion of the first structure is formed over the photodiode by etching the second structure, the etch stop layer pattern and the opaque upper portion of the first structure.