Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mukul Saran0
Date of Patent
May 19, 2009
0Patent Application Number
115571900
Date Filed
November 7, 2006
0Patent Primary Examiner
Patent abstract
A semiconductor package comprising a die adjacent a substrate, a supporting plate adjacent the die, and a conducting plate abutting the supporting plate and electrically coupled to a metal apparatus adjacent the substrate and the die using a plurality of bond wires. The metal apparatus supplies power to the conducting plate.
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