Patent attributes
A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration. The mold temperature adjusting apparatus comprises a high temperature fluid tank and a low temperature fluid tank, a high temperature fluid supply system and a high temperature fluid return system between the mold and the high temperature fluid tank, a low temperature fluid supply system and a low temperature fluid return system between the mold and the low temperature fluid tank, a high temperature fluid by-pass system and a low temperature fluid by-pass system, a heat recovery tank connected to the high temperature fluid tank and a pressure adjusting device.
