Patent attributes
A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S1) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S1) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S2) wider than the arrangement area (S1) of the reinforcing plate.
