US Patent 7523780 High density electronic cooling triangular shaped microchannel device
Patent 7523780 was granted and assigned to The Aerospace Corporation on April, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 19, 2005
0
Date of Patent
April 28, 2009
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Patent Application Number
11231192
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Patent Citations Received
Patent Inventor Names
James Todd Dickey
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Tung Ting Lam
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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