US Patent 7521304 Method for forming integrated circuit

Patent 7521304 was granted and assigned to Advanced Micro Devices on April, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Advanced Micro Devices

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

75213040

Patent Inventor Names

Philip A. Fisher0

Richard J. Huang0

Richard C. Nguyen0

Srikanteswara Dakshina-Murthy0

Scott A. Bell0

Cyrus E. Tabery0

Lu You0

Date of Patent

April 21, 2009

Patent Application Number

102307750

Date Filed

August 29, 2002

Patent Primary Examiner

‌

Jack Chen

Patent abstract

A method of forming an integrated circuit includes providing a buffer layer comprising a dielectric material above a layer of conductive material and providing a layer of mask material above the buffer layer. The mask material comprises amorphous carbon. The method also includes removing a portion of the buffer layer and the layer of mask material to form a mask. A feature is formed in the layer of conductive material according to the mask.