US Patent 7518226 Integrated circuit packaging system with interposer
All edits
Edits on 17 Sep, 2023
Golden AI
Edits made to:
Infobox (+4 properties)
Infobox
Patent Inventor Names
Allan P. Ilagan0
Dario S. Filoteo, Jr.0
Philip Lyndon Cablao0
Rachel Layda Abinan0
Edits on 15 Sep, 2023
Golden AI
Edits made to:
Article (+294 characters)
Article
Patent abstract
An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 18 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07518226 Integrated circuit packaging system with interposer US Patent 7518226 Integrated circuit packaging system with interposer
Infobox
Patent Number
075182260
Patent Number
75182260
Edits on 4 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
075182260
Date of Patent
April 14, 2009
0Patent Application Number
116716840
Date Filed
February 6, 2007
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 2 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07518226 Integrated circuit packaging system with interposer
Infobox
Is a
Patent jurisdiction
Patent number
07518226
Date of patent
April 14, 2009
Patent application number
11671684
Date Filed
February 6, 2007
Patent primary examiner
Find more entities like US Patent 7518226 Integrated circuit packaging system with interposer
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.