US Patent 7517207 Injection molding device

Patent 7517207 was granted and assigned to Hon Hai Precision Industry Co Ltd on April, 2009 by the United States Patent and Trademark Office.

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Patent Inventor Names

Ming-Chiang Tsai0

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Patent abstract

An injection molding device (100) includes an upper mold (30), a core insert (50), and a lower mold (70). The upper mold defines a main flow passage (311) and a cylindrical receiving cavity (331) communicating with the main flow passage. The core insert is rotatably received in the cylindrical receiving cavity and defines a secondary flow passage (57) communicating with the main flow passage and at least one upper half molding cavity (531). The lower mold defines at least one lower half molding cavity (711) cooperating with the upper half molding cavity to form a full molding cavity.

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https://pdfpiw.uspto.gov/.piw?Docid=075172070

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