The present invention generally relates to dynamic thermal management of a device. In one aspect, a method for thermally controlling a device is provided. The method includes setting a value of a set point in a thermoelectric cooler, wherein the set point corresponds to a first operating state. The method also includes monitoring a condition of the device to determine if the device is in the first operating state or a second operating state. Additionally, the method includes dynamically altering the value of the set point according to an algorithm upon determination that the device is in the second operating state. In another aspect, a method for dynamically controlling a device having a thermoelectric cooler is provided. In yet a further aspect, a system for dynamic thermal management of a device is provided.