US Patent 7511363 Copper interconnect

Patent 7511363 was granted and assigned to Micron Technology on March, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Micron Technology

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

75113630

Patent Inventor Names

Salman Akram0

Date of Patent

March 31, 2009

Patent Application Number

111370350

Date Filed

May 25, 2005

Patent Primary Examiner

‌

Thanh Nguyen

Patent abstract

An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described wherein the bond pad on a surface of the semiconductor device comprises a layer of copper and at least one layer of metal and/or at least a barrier layer of material between the copper layer and one layer of metal on the copper layer to form a bond pad.