Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Xiaotian Zhang0
Kai Liu0
Ming Sun0
Date of Patent
March 31, 2009
Patent Application Number
11150489
Date Filed
June 10, 2005
Patent Primary Examiner
Patent abstract
A DFN semiconductor package is disclosed. The package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.
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