US Patent 7504592 Electromagnetic interference shields and related manufacturing methods

According to various aspects, exemplary embodiments are provided of board level shields having single piece constructions. In an exemplary embodiment, a shielding enclosure includes sidewalls and an integral top surface. The sidewalls include upper and lower portions cooperatively defining an interlock therebetween. The upper sidewall portions depend downwardly from the integral top surface. The interlock releasably attaches the integral top surface and upper sidewall portions to the lower sidewall portions. By disengaging the interlock, the integral top surface and upper sidewall portions may then be completely separated from the lower sidewall portions. The integral top surface and upper sidewall portions may also be reattached to the lower sidewall portions by engagement of the interlock.