Patent attributes
Disclosed is a molding system. The molding system, includes: a conduit assembly, including: a barrel assembly, including: a first conduit being configured to receive, in use, a flowable molding material, and a second conduit being coupled to the first conduit; a conduit clamp being configured to be operated at a relatively low operating temperature; and a conduit connection being retained in the conduit clamp, the conduit connection, including: a first flange being coupled to a first port of the first conduit, and a second flange being coupled to a second port of the second conduit, the conduit connection being configured to be operated at an operating temperature being relatively higher than that of the conduit clamp, and responsive to the conduit connection becoming heated to the operating temperature, the conduit clamp acts to constrain thermal expansion of the conduit connection.
