Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Atsuhiro Nishida0
Takeshi Nakamura0
Ryosuke Usui0
Hideki Mizuhara0
Date of Patent
February 24, 2009
0Patent Application Number
110821500
Date Filed
March 16, 2005
0Patent Primary Examiner
Patent abstract
A semiconductor apparatus includes a substrate and elements or semiconductor chips provided on the substrate. The elements are sealed by being brought into contact with a sealing compound. The surface of contact on the elements or the sealing compound is plasma treated. The semiconductor chip is adhesively attached to another semiconductor chip via an adhesive compound. The surface of the semiconductor chip in contact with the adhesive compound is plasma treated.
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