US Patent 7495266 Strained silicon-on-silicon by wafer bonding and layer transfer
Patent 7495266 was granted and assigned to Massachusetts Institute of Technology on February, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 16, 2004
Date of Patent
February 24, 2009
Patent Application Number
10869814
Patent Inventor Names
Eugene A. Fitzgerald
0
David M. Isaacson
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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