US Patent 7494334 Mold assembly

Patent 7494334 was granted and assigned to Hon Hai Precision Industry Co Ltd on February, 2009 by the United States Patent and Trademark Office.

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Patent Inventor Names

Ming-Chiang Tsai0

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Patent abstract

The mold assembly (100) is provided including a mold plate (20), a mold core (30), an elastic member (40) and an adjusting member (50). The mold plate has a receiving cavity (25) and a receiving aperture (27) defined therein. The mold core is received in the receiving cavity. The elastic member, configured to restore the mold core to its previous position, is disposed between the mold plate and the mold core. The adjusting member is received in the receiving aperture, engaging with the mold core to drive the mold core to move relative to the mold plate.

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=074943340

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