US Patent 7491570 Die package having an adhesive flow restriction area
Patent 7491570 was granted and assigned to Micron Technology on February, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 1, 2004
Date of Patent
February 17, 2009
Patent Application Number
10930789
Patent Inventor Names
Jeremy E. Minnich
0
Bret K. Street
0
James M. Derderian
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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