US Patent 7487586 Process for producing semiconductor device

Patent 7487586 was granted and assigned to Nitto Denko on February, 2009 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7487586

Date of Patent

February 10, 2009

Patent Application Number

10737853

Date Filed

December 18, 2003

Patent Primary Examiner

‌

Rick K Chang

Patent abstract

A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device comprising a substrate having bumps formed thereon, comprises covering the bumps with an adhesive film which has a modulus of elasticity (−55° C.) of from 100 MPa to 5 GPa and has a thickness corresponding to from 5 to 40% of the height of the bumps, and then disposing the adhesive film on the substrate so that the bumps pierce through the adhesive film and come to protrude therefrom.