Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 27, 2009
Patent Application Number
11161987
Date Filed
August 24, 2005
Patent Primary Examiner
Patent abstract
A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.
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