Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Byeongdu Lee0
Yong Taek Hwang0
Weontae Oh0
Moonhor Ree0
Date of Patent
January 20, 2009
0Patent Application Number
105308150
Date Filed
August 20, 2004
0Patent Primary Examiner
Patent abstract
Provided are a porous organosilicate polymer composite prepared by heating an organic/inorganic hybrid polymer in which an organosilicate polymer is chemically bonded to a radial pore-forming polymer ended with a hydrolyzable alkoxysilyl group and used as a core molecule, and a semiconductor device using an organosilicate polymer composite film including the porous organosilicate polymer composite. The organosilicate polymer composite film has a very low dielectric constant, and thus, is useful as a dielectric film of the semiconductor device.
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