Patent attributes
A stacked die system (10) has a first die (16) having a first surface with active circuitry, a second die (18) having a first surface with active circuitry, and a conductive shield (28) interposed between the first surface of the first die and the first surface of the second die. In one embodiment, the distance between the first surfaces of the first and second die is less than one millimeter. The stacked die system may also include a package substrate (12) where the active circuitry of the first and second die are electrically connected to the package substrate. The electrical connections may be formed using wire bonds (56, 58, 60, 62). Alternatively, the first die may be connected to the package substrate in a flip chip configuration. In one embodiment, the active circuitry of the first die generates RF signals where the shield helps protect the RF signals from interference caused by the active circuitry of the second die.
