US Patent 7479317 Adhesive sheet roll for wafer processing

Patent 7479317 was granted and assigned to Nitto Denko on January, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

74793170

Patent Inventor Names

Kouichi Hashimoto0

Kazuhiko Yamamoto0

Date of Patent

January 20, 2009

Patent Application Number

110548260

Date Filed

February 10, 2005

Patent Primary Examiner

‌

Patricia L. Nordmeyer

Patent abstract

An adhesive film in roll for wafer processing is constituted by laminated multiple layers including a base film, a radiation curing type adhesive layer, and a releasing film in this sequence, in which the arithmetic average roughness (Ra) of the side of the base film and/or releasing film opposite to the radiation curing type adhesive layer is 1 μm or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.