US Patent 7476955 Die package having an adhesive flow restriction area
Patent 7476955 was granted and assigned to Micron Technology on January, 2009 by the United States Patent and Trademark Office.
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A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches that extend from one edge of the transparent element to the other edge. A third embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches. A fourth embodiment has a transparent element with an adhesive flow restriction area formed as a protuberance. A fifth embodiment comprises a trench in the die. A sixth embodiment has a die with a plurality of trenches in the die as an adhesive flow restriction area. A seventh embodiment has a die with a protuberance.
US Patent 07476955 Die package having an adhesive flow restriction area US Patent 7476955 Die package having an adhesive flow restriction area
US Patent 07476955 Die package having an adhesive flow restriction area
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