US Patent 7476328 Method of manufacturing printed circuit board

Patent 7476328 was granted and assigned to Nitto Denko on January, 2009 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

74763280

Patent Inventor Names

Takashi Oda0

Date of Patent

January 13, 2009

Patent Application Number

113175960

Date Filed

December 23, 2005

Patent Primary Examiner

‌

Binh X Tran

Patent abstract

A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth electrode is provided on the side opposing the AC electrode. More specifically, the printed circuit board is provided outside a sheath layer that is a region having a high plasma density generated in the vicinity of the AC electrode. The frequency of an AC power supply is preferably not more than 1 GHz. The pressure in the device is preferably in the range from 1.33×10−2 Pa to 1.33×102 Pa. The inter-electrode distance between the AC electrode and the earth electrode is preferably not more than 150 mm, more preferably from 40 mm to 100 mm.