US Patent 7471034 Ultrasound transducer and method of producing the same

In an ultrasound transducer arrangement comprising at least one piezoelectric body with a lower and an upper electrode and a coupling layer including a wafer on which the ultrasound transducers are disposed and are connected to the lower electrode, a conductor structure of uniform height is disposed on the wafer and is in contact with the lower electrode and any space between the piezoelectric body and the wafer is completely filled with a cement material.