Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toshiharu Seko0
Date of Patent
December 16, 2008
Patent Application Number
10668234
Date Filed
September 24, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
The semiconductor device uses an insulating resin that contains at least a resin anti-repellent for adjusting wettability of the insulating resin. The insulating resin is applied on a circuit board, and a semiconductor element is placed thereon and pressed against it. The applied pressure pushes out a portion of the insulating resin under the semiconductor element. This portion of the insulating resin combines with a portion of the insulating resin around the semiconductor element to form a resin fillet on the side surfaces of the semiconductor element.
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