Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasunari Ooyabu0
Jun Ishii0
Date of Patent
December 16, 2008
Patent Application Number
11785873
Date Filed
April 20, 2007
Patent Primary Examiner
Patent abstract
The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed on the metal supporting board to be in contact with the metal supporting board and the semiconductive layer.
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