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US Patent 7462569 Method of manufacturing semiconductor device

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Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7462569
Date of Patent
December 9, 2008
Patent Application Number
11508230
Date Filed
August 23, 2006
Patent Primary Examiner
‌
Long K. Tran
Patent abstract

A method of manufacturing a semiconductor device bakes a first semiconductor substrate on which a sacrifice film is formed in a reaction chamber to preliminarily coat an inner wall of the reaction chamber with a component of a gas generated by the sacrifice film, and bakes a second semiconductor substrate on which a predetermined film including the same component as that of the sacrifice film is formed in the preliminarily coated reaction chamber, while irradiating electron beams on the predetermined film to change quality of the predetermined film.

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