US Patent 7459768 Semiconductor wafer and dicing method
Patent 7459768 was granted and assigned to Elpida Memory on December, 2008 by the United States Patent and Trademark Office.
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In order to improve the yield by suppressing peeling or the like of an accessory pattern when dicing, there include: a substrate on which an element forming region and a scribe line region formed around the element forming region are provided; an accessory pattern formed on the scribe line region; a protective film covering the element forming region on the substrate; and supporting films located in the opening formed in the scribe line region and supporting the accessory pattern locally. Each of the supporting film is formed as a continuation of the protective film, and has a function of supporting an edge of the accessory pattern while avoiding a part along which the accessory pattern is diced with a dicing blade.
US Patent 07459768 Semiconductor wafer and dicing method US Patent 7459768 Semiconductor wafer and dicing method
US Patent 07459768 Semiconductor wafer and dicing method
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