US Patent 7457123 Chassis mounted heat sink system

Patent 7457123 was granted and assigned to ADC Telecommunications on November, 2008 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

ADC Telecommunications

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7457123

Date of Patent

November 25, 2008

Patent Application Number

11747039

Date Filed

May 10, 2007

Patent Primary Examiner

Boris L. Chervinsky

Patent abstract

A heat sink for an electronics enclosure is disclosed. The heat sink comprises a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended profile that tapers from a first end having a first thickness to a second end having a second thickness that is larger than the first thickness. A mounting plate is contiguous with the second end, and the mounting plate is configured to couple the heat sink to a chassis of the electronics enclosure. A thermal interface pad is coupled to the outer surface of the thermal conduction section.