Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yung-Cheng Lu0
Pi-Tsung Chen0
Syun-Ming Jang0
Tien-I Bao0
Hui-Lin Chang0
Keng-Chu Lin0
Lih-Ping Li0
Date of Patent
November 25, 2008
0Patent Application Number
108847190
Date Filed
July 3, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor device with improved resistance to delamination and method for forming the same the method including providing a semiconductor wafer comprising a metallization layer with an uppermost etch stop layer; forming at least one adhesion promoting layer on the etch stop layer; and, forming an inter-metal dielectric (IMD) layer on the at least one adhesion promoting layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
