Patent attributes
This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an electrical connection system is provided that includes a circuit board upon which are disposed a one or more signal contact pads, each of which is configured to communicate with a complementary element of an external electrical device such that a respective shunt capacitance is defined. One or more of the signal contact pads define at least one open portion through which communication signals cannot pass. The open portions of the one or more signal contact pads are configured to reduce a shunt capacitance that is defined at the coupling of each signal contact pad and corresponding connector. As well, one or more signal lines are likewise disposed on the circuit board such that each signal line is connected to a respective one of the signal contact pads. The circuit board finally includes one or more ground contact pads and power contact pads.
