Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sywert H. Brongersma0
Gerald Beyer0
Date of Patent
November 18, 2008
0Patent Application Number
117336500
Date Filed
April 10, 2007
0Patent Primary Examiner
Patent abstract
The present invention relates to a method for obtaining enlarged Cu grains in small trenches. More specifically it related to a method for creating enlarged copper grains or inducing super secondary grain growth in electrochemically deposited copper in narrow trenches and/or vias to be used in semiconductor devices.
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